LX5541 p roduction d ata s heet microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-89 8-8121, fax: 714-893-2570 page 1 w w w. microsemi . co m co-package 2.3 C 2.5 ghz hbt power amp + phemt low noise amplifier + spdt switch tm ? copyright ? 2006 rev. 1.3, 2008-02-11 d e s c r i p t i o n d e s c r i p t i o n d e s c r i p t i o n d e s c r i p t i o n LX5541 is a co-package rfic consisting of an ingap/gaas heterojunction bipolar transistor (hbt) power amplifier, an ingaas pseudomorphic hemt (phemt) low noise amplifier, and a spdt switch. all three rf devices are optimized for wlan applications in the 2.3 to 2.5 ghz frequency range. the pa is implemented as a two- stage monolithic microwave integrated circuit (mmic) with active bias and output pre-matching. the lna is fully matched internally, and the lna is connected to the rx port of spdt switch directly inside the mlpq package. both pa and lna operate with single low voltage supply of 3.3v. the pa (including spdt switch loss) offers 27 db power gain between 2.3- 2.5ghz, at a low quiescent current of 90ma. for 19dbm ofdm output power (64qam, 54mbps) at the antenna port, the pa including spdt switch provides a low evm (error-vector magnitude) of about 3%, and consumes 145 ma total dc current. the lna (including spdt switch loss) offers 13 db gain, 2 db noise figure (switch contribution included) and a high input ip3 of +5 dbm at 10 ma dc current. LX5541 is available in a low profile 16-pin 3mmx3mm micro-lead package (mlpq-16l). LX5541 with a pa, lna and spdt integrated in a small, low profile, and low thermal resistance package offers an ideal compact front end solution for ieee 802.11b/g/n applications. important: for the most current data, consult microsemi s website: http://www.microsemi.com k e y f e a t u r e s k e y f e a t u r e s k e y f e a t u r e s k e y f e a t u r e s small footprint: 3x3mm 2 low profile: 0.45mm 2.3-2.5ghz operation single-polarity 3.3v supply on-chip active bias circuit for both pa and lna tx features: input matched pa quiescent current ~ 90ma power gain ~ 27 db * total current ~ 145ma for pout=19 dbm ofdm * evm~3 % at 19dbm (2% at 17dbm) 54mbps/64qam rx features: lna gain ~ 13 db * lna noise figure ~ 2 db * lna input ip3 ~ +5dbm * lna on-chip input/output match * including spdt switch loss a p p l i c a t i o n s a p p l i c a t i o n s a p p l i c a t i o n s a p p l i c a t i o n s ieee 802.11b/g/n b l o c k d i a b l o c k d i a b l o c k d i a b l o c k d i a g r a m g r a m g r a m g r a m ctl1 ctl2 ant swtxi paout deti deto pain vb1/vb2 vcc lnao vdd ext . match ctl1 ant vdd rxout vcc vref txin det ctl2 l l x x 5 5 5 5 4 4 1 1
LX5541 p roduction d ata s heet microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-89 8-8121, fax: 714-893-2570 page 2 w w w. microsemi . co m co-package 2.3 C 2.5 ghz hbt power amp + phemt low noise amplifier + spdt switch tm ? copyright ? 2006 rev. 1.3, 2008-02-11 p r o d u c t h i g h l i g h t p r o d u c t h i g h l i g h t p r o d u c t h i g h l i g h t p r o d u c t h i g h l i g h t a b s o l u t e m a x i m u m r a t a b s o l u t e m a x i m u m r a t a b s o l u t e m a x i m u m r a t a b s o l u t e m a x i m u m r a t i n g s i n g s i n g s i n g s dc supply voltage, rf off (pa) .................... .................................................. 5 v (lna) ................................................... ............... 4v collector current (pa) ............................. .................................................. 5 00ma drain current (lna) ............................ ................................................... .. 40ma total power dissipation ............................ ................................................... .....2w rf input power ..................................... ................................................... + 10 dbm operation ambient temperature...................... ............................. -40c to +85c storage temperature ................................ ................................... -65c to +150c peak package solder reflow temp. (40 second max exp osure) -260c (+0,-5) note: exceeding these ratings could cause damage to the device. all voltages are with respect to ground. currents are positive into, negative out of specified terminal . x denotes respective pin designator 1, 2, or 3 t h e r m a l d a t a t h e r m a l d a t a t h e r m a l d a t a t h e r m a l d a t a ll plastic mlpq 3x3 x1 thermal resistance - junction to c ase , ? jc 12.8 c/w thermal resistance - junction to a mbient , ? ja 53.4 c/w p a c k a g e p i n o u p a c k a g e p i n o u p a c k a g e p i n o u p a c k a g e p i n o u t tt t 4 8 12 pain vdd 14 13 vb1 deto 15 ant nc ctl1 16 9 vcc lnao vb2 7 ctl2 nc 5 swtxi 6 13 11 paout 2 10 deti vc1 lq p ackage (bottom view) rohs/pb-free 100% matte tin lead finish p a c k a g e o r d e r i n f o p a c k a g e o r d e r i n f o p a c k a g e o r d e r i n f o p a c k a g e o r d e r i n f o ll plastic mlpq 16 pin 3x3 rohs compliant /pb-free LX5541ll note: available in tape & reel. append the letters tr to the part number. (i.e. LX5541ll-tr) msc 5530 608y msc 5541 717a p p a a c c k k a a g g e e d d a a t t a a l l x x 5 5 5 5 4 4 1 1 e e l l e e c c t t r r i i c c a a l l s s
microsemi analog mixed signal group 11861 western avenue, garden grove, ca. 92841, 714-898-8121, fax: 714-893-2570 tm ? www. microsemi . com copyright information thank you for your interest in microsemi ? analog mixed signal products. the full data sheet for this device contains proprietary information. to obtain a copy, please contact your loca l microsemi sales representative. the name of your local representative ca n be obtained at the following link http://www.microsemi.com/contact/contactfind.asp or contact us directly by sending an email to: ipgdatasheets@microsemi.com be sure to specify the data sheet you are requesting and include your company name and contact inform ation and or vcard. we look forward to hearing from you.
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